ElectroFlo 4.7

Analyze thermal cooling design of electronic packages
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Latest version:
4.7.1 See all
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TES
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ElectroFlo is a thermal analysis software for electronic cooling package design. This software can be used for the component level, PCB analysis, and all the way up to the system level. It can consider conduction, convection, radiation, and conjugate heat transfer modes for simulation.

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